Sockets and Chip Carriers

IC Socket, DIP4, 4 Contact(s)

IC Socket, DIP46, 46 Contact(s), 2.54mm Term Pitch, 22.86mm Row Spacing, Solder

IC Socket, SIP4, 4 Contact(s)

IC Socket, DIP40, 40 Contact(s)

IC Socket, BGA940, 940 Contact(s), Surface Mount

IC Socket, BGA940, 940 Contact(s), Surface Mount

IC Socket, BGA940, 940 Contact(s), Surface Mount

IC Socket, BGA940, 940 Contact(s), Surface Mount

IC Socket, PGA478, 478 Contact(s), 1.27mm Term Pitch, 1.27mm Row Spacing, Surface Mount

IC Socket, DIP22, 22 Contact(s)

IC Socket, DIP60, 60 Contact(s)

PGA132, 132 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder

PGA132, 132 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder

PGA133, 133 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder

IC Socket, BGA416, 416 Contact(s), 1.27mm Term Pitch, 0.1mm Row Spacing, Solder

Contactors/Accessories

Contactors/Accessories

IC Socket, PGA52, 52 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder

IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Wire Wrap

IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder

IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Wire Wrap

IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder

IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Surface Mount

IC Socket, DIP52, 40 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder

Heatshrink molded parts series Helashrink, type HellermannTyton 100/1100. For the protection against environmental influences, with inner lip As straight connector housings, type 15.