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GS8170DW72AC-300I

GSI Technology, Inc.

GSI Technology, Inc. GS8170DW72AC-300I
  • ECCN
    3A991.B.2.B
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    14 mm
  • Length
    22 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B209
  • Memory Width
    72
  • Organization
    256KX72
  • Package Code
    LBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    18874368 bit
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    1.8 ns
  • Number of Words
    262144 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.7 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Number of Functions
    1
  • Number of Terminals
    209
  • Number of Words Code
    256K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.95 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    220

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GS8170DW72AC-300I
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GS8170DW72AC-300I