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GS811V32T4I

GSI Technology, Inc.

GSI Technology, Inc. GS811V32T4I
  • ECCN
    3A991.b.2.b
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    32
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Memory Organization
    32KX32
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.635
  • Access Time-Max (ns)
    12
  • Number of Words Code
    32K
  • Memory Density (bits)
    1048576
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Number of Words (words)
    32768
  • Standby Current-Max (A)
    0.015
  • Supply Current-Max (mA)
    215
  • Package Equivalence Code
    QFP100,.63X.87
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    220
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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GS811V32T4I