Renesas Electronics Corp. 72V225L15TFG8 | 搜芯易Sourcengine

Renesas Electronics Corp. 72V225L15TFG8

生命周期状态
Contact Mfr
RoHS
符合RoHS标准
REACH
REACH compliant
说明
FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 18 64-Pin STQFP
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
10
Length (mm)
10
JESD-30 Code
S-PQFP-G64
Memory Width
18
Package Code
LFQFP
Output Enable
YES
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Cycle Time (ns)
15
Parallel/Serial
PARALLEL
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
EASILY EXPANDABLE IN DEPTH AND WIDTH
Memory Organization
1KX18
Number of Functions
1
Number of Terminals
64
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
10
Number of Words Code
1K
Memory Density (bits)
18432
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.6
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
1024
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30