Renesas Electronics Corp. 7201LA20DGB | 搜芯易Sourcengine

Renesas Electronics Corp. 7201LA20DGB

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
FIFO, 512X9, 20ns, Asynchronous, CMOS, CDIP28
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
15.24
Length (mm)
36.576
JESD-30 Code
R-GDIP-T28
Memory Width
9
Package Code
DIP
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e3
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Cycle Time (ns)
30
Parallel/Serial
PARALLEL
Terminal Finish
MATTE TIN
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
512X9
Number of Functions
1
Number of Terminals
28
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
20
Number of Words Code
512
Memory Density (bits)
4608
Package Body Material
CERAMIC, GLASS-SEALED
Seated Height-Max (mm)
4.699
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
512
Standby Current-Max (A)
0.015
Supply Current-Max (mA)
100
Package Equivalence Code
DIP28,.6
Clock Frequency-Max (MHz)
33.3
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883 Class B (Modified)