Texas Instruments Incorporated ZDM8147L3MOBCYE1 | 搜芯易Sourcengine

Texas Instruments Incorporated ZDM8147L3MOBCYE1

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA684
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
23
Length (mm)
23
JESD-30 Code
S-PBGA-B684
Package Code
HBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Terminal Position
BOTTOM
Additional Feature
IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY
Number of Terminals
684
Terminal Pitch (mm)
0.8
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.06
Supply Voltage-Max (V)
3.47
Supply Voltage-Min (V)
3.14
Supply Voltage-Nom (V)
3.3
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30