XQZU3EG-L1SFRC784I
Advanced Micro Devices, Inc. (AMD)
- 生命周期状态Active
- 说明Programmable SoC, CMOS, PBGA784
- 类别
- HTS Code8542.31.00.01
- SB Code8542.31.00.70
- TechnologyCMOS
- Width (mm)23
- Length (mm)23
- JESD-30 CodeS-PBGA-B784
- Package CodeFBGA
- Package ShapeSQUARE
- Package StyleGRID ARRAY, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee0
- Terminal FinishTin/Lead (Sn63Pb37)
- Terminal PositionBOTTOM
- Number of Terminals784
- Terminal Pitch (mm)0.8
- Package Body MaterialPLASTIC/EPOXY
- Seated Height-Max (mm)3.52
- Supply Voltage-Max (V)0.892
- Supply Voltage-Min (V)0.808
- Supply Voltage-Nom (V)0.85
- Package Equivalence CodeBGA784,28X28,32
- Moisture Sensitivity Level4
- uPs/uCs/Peripheral ICs TypePROGRAMMABLE SoC
- Peak Reflow Temperature (Cel)220
- Operating Temperature-Max (Cel)100
- Operating Temperature-Min (Cel)-40
- Time@Peak Reflow Temperature-Max (s)20
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