Advanced Micro Devices, Inc. (AMD) XQ7Z030-1RF676Q | 搜芯易Sourcengine

Advanced Micro Devices, Inc. (AMD) XQ7Z030-1RF676Q

生命周期状态
Contact Mfr
说明
FPGA Zynq®-7000 Family 78600 Cells 28nm Technology 676-Pin FCBGA
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs PROGRAMMABLE SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
Width (mm)
27
Length (mm)
27
JESD-30 Code
S-PBGA-B676
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
AUTOMOTIVE
Terminal Position
BOTTOM
Number of Terminals
676
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.37
Package Equivalence Code
BGA676,26X26,40
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
PROGRAMMABLE SoC
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30