Texas Instruments Incorporated XDM505XXBABF | 搜芯易Sourcengine

Texas Instruments Incorporated XDM505XXBABF

生命周期状态
Discontinued
说明
SoC, CMOS, PBGA367
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
JESD-30 Code
S-PBGA-B367
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Temperature Grade
AUTOMOTIVE
Terminal Position
BOTTOM
Number of Terminals
367
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Max (V)
1.2
Supply Voltage-Min (V)
1.11
Supply Voltage-Nom (V)
1.15
uPs/uCs/Peripheral ICs Type
SoC
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-40
Screening Level / Reference Standard
AEC-Q100