XCZU9CG-L1SFVA625I

Xilinx,Inc.

Xilinx,Inc. XCZU9CG-L1SFVA625I
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    21
  • Length (mm)
    21
  • JESD-30 Code
    S-PBGA-B625
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Bus Compatibility
    I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO OPERATES AT 0.85V NOMINAL SUPPLY
  • Number of Terminals
    625
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.43
  • Supply Voltage-Max (V)
    0.742
  • Supply Voltage-Min (V)
    0.698
  • Supply Voltage-Nom (V)
    0.72
  • Package Equivalence Code
    BGA625,25X25,32
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

XCZU9CG-L1SFVA625I有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
XCZU9CG-L1SFVA625I
提交询价
XCZU9CG-L1SFVA625I