Advanced Micro Devices, Inc. (AMD) XCZU5EG-3FBVB900I | 搜芯易Sourcengine

Advanced Micro Devices, Inc. (AMD) XCZU5EG-3FBVB900I

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Programmable SoC, CMOS, PBGA900
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs PROGRAMMABLE SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
Width (mm)
31
Length (mm)
31
JESD-30 Code
S-PBGA-B900
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
900
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.88
Supply Voltage-Nom (V)
0.9
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
PROGRAMMABLE SoC
Peak Reflow Temperature (Cel)
245
Operating Temperature-Max (Cel)
100
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30