Xilinx,Inc. XCZU3CG-1LSFVA625I | 搜芯易Sourcengine

Xilinx,Inc. XCZU3CG-1LSFVA625I

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Programmable SoC, CMOS, PBGA625
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs PROGRAMMABLE SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
Width (mm)
21
Length (mm)
21
JESD-30 Code
S-PBGA-B625
Package Code
FBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Bus Compatibility
CAN, I2C, SPI, UART
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
625
Terminal Pitch (mm)
0.8
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.43
Supply Voltage-Nom (V)
0.85
External Data Bus Width
0
Package Equivalence Code
BGA625,25X25,32
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
PROGRAMMABLE SoC
Peak Reflow Temperature (Cel)
250
Operating Temperature-Max (Cel)
100
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30