产品制造商
提交询价BOM 工具

XCZU25DR-1FFVE1156E

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XCZU25DR-1FFVE1156E
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B1156
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1156
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    0.876
  • Supply Voltage-Min (V)
    0.825
  • Supply Voltage-Nom (V)
    0.85
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    RFSOC
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

XCZU25DR-1FFVE1156E有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
XCZU25DR-1FFVE1156E
提交询价
XCZU25DR-1FFVE1156E