Texas Instruments Incorporated XAM5718AABCXEA | 搜芯易Sourcengine

Texas Instruments Incorporated XAM5718AABCXEA

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA760
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
23
Length (mm)
23
JESD-30 Code
S-PBGA-B760
Package Code
FBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
760
Terminal Pitch (mm)
0.8
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.96
Supply Voltage-Max (V)
1.2
Supply Voltage-Min (V)
1.11
Supply Voltage-Nom (V)
1.15
Package Equivalence Code
BGA760,28X28,32
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
250
Operating Temperature-Max (Cel)
105
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30