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WS1M8-17FMA

Microsemi Corporation

Microsemi Corporation WS1M8-17FMA
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    12.95
  • Length (mm)
    23.37
  • JESD-30 Code
    R-CDFP-F36
  • Memory Width
    8
  • Package Code
    GDFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, GUARD RING Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    1MX8
  • Number of Functions
    1
  • Number of Terminals
    36
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    17
  • Number of Words Code
    1M
  • Memory Density (bits)
    8388608
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    3.18
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1048576
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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