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UPD75P3018GK-BE9

Renesas Electronics Corp.

Renesas Electronics Corp. UPD75P3018GK-BE9
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Bit Size
    4
  • CPU Family
    UPD75XL
  • Technology
    MOS
  • Width (mm)
    12
  • Length (mm)
    12
  • Speed (MHz)
    6
  • ADC Channels
    NO
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    S-PQFP-G80
  • PWM Channels
    NO
  • Package Code
    TFQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of I/O Lines
    40
  • Number of Terminals
    80
  • Program Memory Type
    OTPROM
  • Terminal Pitch (mm)
    0.5
  • Data RAM Size (bytes)
    512
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.2
  • External Data Bus Width
    0
  • Supply Current-Max (mA)
    11
  • Package Equivalence Code
    TQFP80,.55SQ
  • Clock Frequency-Max (MHz)
    6
  • Program Memory Size (words)
    32768
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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