产品制造商
提交询价BOM 工具

UPD66702F1-YXX-HN3

Renesas Electronics Corp.

Renesas Electronics Corp. UPD66702F1-YXX-HN3
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • CPU Family
    ARM7
  • Technology
    CMOS
  • Width (mm)
    19
  • Length (mm)
    19
  • Speed (MHz)
    60
  • ADC Channels
    YES
  • DMA Channels
    NO
  • JESD-30 Code
    S-PBGA-B240
  • PWM Channels
    YES
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    28
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    240
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    0.8
  • Data RAM Size (bytes)
    8192
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    2.7
  • Supply Voltage-Min (V)
    2.3
  • Supply Voltage-Nom (V)
    2.5
  • External Data Bus Width
    32
  • Supply Current-Max (mA)
    450
  • Package Equivalence Code
    BGA240,22X22,32
  • Clock Frequency-Max (MHz)
    4.04
  • Program Memory Size (words)
    3072
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

UPD66702F1-YXX-HN3有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
UPD66702F1-YXX-HN3
提交询价
UPD66702F1-YXX-HN3