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UPD30131F1-200-GA2

Renesas Electronics Corp.

Renesas Electronics Corp. UPD30131F1-200-GA2
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Bit Size
    64
  • Technology
    CMOS
  • Width (mm)
    16
  • Length (mm)
    16
  • Speed (MHz)
    200
  • JESD-30 Code
    S-PBGA-B224
  • Package Code
    FBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Address Bus Width
    24
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    224
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.76
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA224,18X18,32
  • Clock Frequency-Max (MHz)
    48
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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UPD30131F1-200-GA2