产品制造商
提交询价BOM 工具

UPD23C8000LXGY-XXX-MKH

Renesas Electronics Corp.

UPD23C8000LXGY-XXX-MKH 产品规格书
Renesas Electronics Corp. UPD23C8000LXGY-XXX-MKH
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G48
  • Memory Width
    16
  • Organization
    512KX16
  • Package Code
    TSSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    8388608 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    200 ns
  • Number of Words
    524288 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    25 mA
  • Number of Terminals
    48
  • Standby Current-Max
    2.0E-5 Amp
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Package Equivalence Code
    TSSOP48,.71,20
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel

UPD23C8000LXGY-XXX-MKH有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
UPD23C8000LXGY-XXX-MKH
提交询价
UPD23C8000LXGY-XXX-MKH