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UPD23C16300F9-XXX-BC3-A

Renesas Electronics Corp.

Renesas Electronics Corp. UPD23C16300F9-XXX-BC3-A
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B48
  • Memory Width
    16
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    256KX16
  • Number of Functions
    1
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    150
  • Number of Words Code
    1M
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1048576
  • Standby Current-Max (A)
    3.0E-5
  • Supply Current-Max (mA)
    30
  • Package Equivalence Code
    BGA48,6X8,32
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -10

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