Texas Instruments Incorporated TM4C123BH6NMRI7R | 搜芯易Sourcengine

Texas Instruments Incorporated TM4C123BH6NMRI7R

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
MCU 32-bit ARM Cortex M4F RISC 256KB Flash 1.2V/3.3V 157-Pin NFBGA T/R
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
3A991.A.2
ECCN Governance
EAR
HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
9
Length (mm)
9
JESD-30 Code
S-PBGA-B157
Package Code
VFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position
BOTTOM
Number of Terminals
157
Terminal Pitch (mm)
0.65
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1
Supply Voltage-Max (V)
1.32
Supply Voltage-Min (V)
1.08
Supply Voltage-Nom (V)
1.2
Package Equivalence Code
BGA157,13X13,25
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30