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TG80960JT100

Intel Corporation

Intel Corporation TG80960JT100
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Speed (MHz)
    100
  • JESD-30 Code
    S-PQFP-G132
  • Package Code
    QFP
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e1
  • Low Power Mode
    YES
  • Terminal Finish
    TIN SILVER COPPER
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Terminal Position
    QUAD
  • Number of Terminals
    132
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.45
  • Supply Voltage-Min (V)
    3.15
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    32
  • Supply Current-Max (mA)
    505
  • Package Equivalence Code
    SPQFP132,1.1SQ
  • Clock Frequency-Max (MHz)
    33.3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    260

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TG80960JT100
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TG80960JT100