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TDA4VM88T5BALFRQ1

Texas Instruments Incorporated

Texas Instruments Incorporated TDA4VM88T5BALFRQ1
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    24
  • Length (mm)
    24
  • JESD-30 Code
    S-PBGA-B827
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Position
    BOTTOM
  • Number of Terminals
    827
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.8
  • Supply Voltage-Max (V)
    0.84
  • Supply Voltage-Min (V)
    0.76
  • Supply Voltage-Nom (V)
    0.8
  • Package Equivalence Code
    BGA827,29X29,32
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    30

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