Texas Instruments Incorporated TDA3MASBABFRQ1 | 搜芯易Sourcengine

Texas Instruments Incorporated TDA3MASBABFRQ1

生命周期状态
Active
说明
Low power SoC w/ full-featured processing & vision acceleration for ADAS applications 367-FCBGA -40 to 125
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
3A991.A.1
ECCN Governance
EAR
HTS Code
8542.31.00.01
SB Code
8542.31.00.00

Technology
CMOS
Width (mm)
15
Length (mm)
15
JESD-30 Code
S-PBGA-B367
Package Code
FBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Temperature Grade
AUTOMOTIVE
Terminal Position
BOTTOM
Number of Terminals
367
Terminal Pitch (mm)
0.65
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.82
Supply Voltage-Max (V)
1.11
Supply Voltage-Min (V)
1.02
Supply Voltage-Nom (V)
1.06
Package Equivalence Code
BGA367,22X22,25
uPs/uCs/Peripheral ICs Type
SoC
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-40
Screening Level / Reference Standard
AEC-Q100