Texas Instruments Incorporated TDA2EGADQABCRQ1 | 搜芯易Sourcengine

Texas Instruments Incorporated TDA2EGADQABCRQ1

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA760
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
5A992.C
ECCN Governance
EAR
HTS Code
8542.31.00.50
SB Code
8542.31.00.70

Technology
CMOS
Width (mm)
23
Length (mm)
23
JESD-30 Code
S-PBGA-B760
Package Code
FBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Temperature Grade
AUTOMOTIVE
Terminal Position
BOTTOM
Number of Terminals
760
Terminal Pitch (mm)
0.8
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.96
Supply Voltage-Max (V)
1.2
Supply Voltage-Min (V)
1.11
Supply Voltage-Nom (V)
1.15
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
250
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-40
Screening Level / Reference Standard
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
30