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TDA1MDRCCYEA0

Texas Instruments Incorporated

Texas Instruments Incorporated TDA1MDRCCYEA0
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    23
  • Length (mm)
    23
  • RAM (words)
    16384
  • Speed (MHz)
    720
  • JESD-30 Code
    S-PBGA-B684
  • Package Code
    FBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Integrated Cache
    YES
  • Address Bus Width
    28
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    684
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.06
  • Supply Voltage-Max (V)
    1.26
  • Supply Voltage-Min (V)
    1.14
  • Supply Voltage-Nom (V)
    1.2
  • External Data Bus Width
    16
  • Package Equivalence Code
    BGA684,28X28,32
  • Clock Frequency-Max (MHz)
    30
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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