Texas Instruments Incorporated TCM4400EGGM | 搜芯易Sourcengine

Texas Instruments Incorporated TCM4400EGGM

生命周期状态
EOL
RoHS
符合RoHS标准
说明
GSM CELL PHONE INTERFACE CHIP (V
类别
Semiconductors Telecom ICs Cellular Telephone Circuits BASEBAND CIRCUIT

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
BICMOS
Width (mm)
10
Length (mm)
10
JESD-30 Code
S-PBGA-B80
Package Code
LFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Telecom IC Type
BASEBAND CIRCUIT
DLA Qualification
Not Qualified
Temperature Grade
OTHER
Terminal Position
BOTTOM
Number of Functions
1
Number of Terminals
80
Terminal Pitch (mm)
0.8
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.4
Supply Voltage-Nom (V)
3
Supply Current-Max (mA)
0.03
Package Equivalence Code
BGA80,10X10,32
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-25