产品制造商
提交询价BOM 工具

TBP28SA86-60MJ

Texas Instruments Incorporated

Texas Instruments Incorporated TBP28SA86-60MJ
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    TTL
  • JESD-30 Code
    R-XDIP-T24
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    16KX8
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    90
  • Number of Words Code
    16K
  • Memory Density (bits)
    131072
  • Package Body Material
    CERAMIC
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1024
  • Package Equivalence Code
    DIP24,.6
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

TBP28SA86-60MJ有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
TBP28SA86-60MJ
提交询价
TBP28SA86-60MJ