Texas Instruments Incorporated SN74LVC2G17QDBVRQ1
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Family
    LVC/LCX/Z
  • Technology
    CMOS
  • Width (mm)
    1.6
  • Length (mm)
    2.9
  • JESD-30 Code
    R-PDSO-G6
  • Package Code
    LSSOP
  • Logic IC Type
    BUFFER
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Packing Method
    TR
  • Schmitt Trigger
    YES
  • Number of Inputs
    1
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Number of Functions
    2
  • Number of Terminals
    6
  • Terminal Pitch (mm)
    0.95
  • Load Capacitance (pF)
    50
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    9.3
  • Seated Height-Max (mm)
    1.45
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    TSOP6,.11,37
  • Output Low Current-Max (mA)
    24
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Propagation Delay-Max@Nom-Sup (ns)
    5.4
  • Screening Level / Reference Standard
    AEC-Q100

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