产品制造商
提交询价BOM 工具

SHG2A32GLDHBWS-SSA

TDK Corporation

SHG2A32GLDHBWS-SSA 产品规格书
TDK Corporation SHG2A32GLDHBWS-SSA
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Width
    39.8 mm
  • Length
    54 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-XSMA-N22
  • Memory Width
    8
  • Organization
    32GX8
  • Package Code
    SMA
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    274877906944 bit
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Number of Words
    34359738368 words
  • Parallel/Serial
    SERIAL
  • Seated Height-Max
    4.5 mm
  • Terminal Position
    SINGLE
  • Supply Current-Max
    240 mA
  • Number of Functions
    1
  • Number of Terminals
    22
  • Programming Voltage
    5 V
  • Standby Current-Max
    3.0E-5 Amp
  • Number of Words Code
    32G
  • Package Body Material
    UNSPECIFIED
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V

SHG2A32GLDHBWS-SSA有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
SHG2A32GLDHBWS-SSA
提交询价
SHG2A32GLDHBWS-SSA