Cypress Semiconductor Corporation S70FS01GSAGBHB210 | 搜芯易Sourcengine

Cypress Semiconductor Corporation S70FS01GSAGBHB210

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Flash, 256MX4, PBGA24
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
3A991.B.1.A
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Technology
CMOS
Width (mm)
6
Length (mm)
8
JESD-30 Code
R-PBGA-B24
Memory Width
4
Package Code
TBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
FLASH
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
IT IS ALSO CONFIGURED AS 1G X 1
Memory Organization
256MX4
Number of Functions
1
Number of Terminals
24
Terminal Pitch (mm)
1
Number of Words Code
256M
Memory Density (bits)
1073741824
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
2
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
2
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
268435456
Programming Voltage (V)
1.8
Clock Frequency-Max (MHz)
133
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
105
Operating Temperature-Min (Cel)
-40
Screening Level / Reference Standard
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED