产品制造商
提交询价BOM 工具

S29GL128S11DHBV20

Cypress Semiconductor Corporation

Cypress Semiconductor Corporation S29GL128S11DHBV20
  • ECCN
    3A991.B.1.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM/TOP
  • Technology
    CMOS
  • Width (mm)
    9
  • Length (mm)
    9
  • JESD-30 Code
    S-PBGA-B64
  • Memory Width
    8
  • Package Code
    LBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    16MX8
  • Number of Functions
    1
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    110
  • Number of Words Code
    16M
  • Memory Density (bits)
    134217728
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    16777216
  • Programming Voltage (V)
    3
  • Supply Current-Max (mA)
    100
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    30

S29GL128S11DHBV20有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
S29GL128S11DHBV20
提交询价
S29GL128S11DHBV20