Cypress Semiconductor Corporation S25FL256SAGBHI303 | 搜芯易Sourcengine

Cypress Semiconductor Corporation S25FL256SAGBHI303

生命周期状态
Transferred
REACH
REACH compliant
说明
Flash, 32MX8, PBGA24
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
3A991.B.1.A
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Technology
CMOS
Width (mm)
6
Length (mm)
8
JESD-30 Code
R-PBGA-B24
Memory Width
8
Package Code
TBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
FLASH
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Serial Bus Type
SPI
Write Protection
HARDWARE/SOFTWARE
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
ALSO CONFIGURABLE AS 128M X 1
Memory Organization
32MX8
Number of Functions
1
Number of Terminals
24
Terminal Pitch (mm)
1
Number of Words Code
32M
Memory Density (bits)
268435456
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
2
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
2.7
Supply Voltage-Nom (V)
3
Data Retention Time-Min
20
Number of Words (words)
33554432
Programming Voltage (V)
3
Standby Current-Max (A)
0.0001
Supply Current-Max (mA)
100
Package Equivalence Code
BGA24,4X6,40
Clock Frequency-Max (MHz)
133
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Endurance (Write/Erase Cycles)
100000
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Write Cycle Time-Max (tWC) (ms)
500
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED