Cypress Semiconductor Corporation S25FL256LAGBHV030 | 搜芯易Sourcengine

Cypress Semiconductor Corporation S25FL256LAGBHV030

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 8ns 24-Pin BGA Tray
类别
Semiconductors Memory ICs

ECCN
3A991.B.1.A
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Technology
CMOS
Width (mm)
6.0000
Length (mm)
8.0000
JESD-30 Code
R-PBGA-B24
Memory Width
8
Package Code
TBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
FLASH
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
IT ALSO HAVE MEMORY WIDTH X 1
Memory Organization
32MX8
Number of Functions
1
Number of Terminals
24
Terminal Pitch (mm)
1.000
Number of Words Code
32M
Memory Density (bits)
268435456.0000000000000000
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
2
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.2000
Supply Voltage-Max (V)
3.60000
Supply Voltage-Min (V)
2.70000
Supply Voltage-Nom (V)
3
Number of Words (words)
33554432.0000000000000000
Programming Voltage (V)
3
Supply Current-Max (mA)
50.000000000000000
Clock Frequency-Max (MHz)
133.00000
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
105.0
Operating Temperature-Min (Cel)
-40.0
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED