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RD74HV8T07TH0

Renesas Electronics Corp.

Renesas Electronics Corp. RD74HV8T07TH0
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Family
    HV
  • Technology
    CMOS
  • Width (mm)
    4.4
  • Length (mm)
    6.5
  • JESD-30 Code
    R-PDSO-G20
  • Package Code
    TSSOP
  • Logic IC Type
    BUFFER
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Packing Method
    TR
  • Schmitt Trigger
    NO
  • Number of Inputs
    1
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    8
  • Number of Terminals
    20
  • Terminal Pitch (mm)
    0.65
  • Load Capacitance (pF)
    50
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    OPEN-DRAIN
  • Propagation Delay (ns)
    200
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Max (V)
    30
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    10
  • Package Equivalence Code
    TSSOP20,.25
  • Output Low Current-Max (mA)
    2.5
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Propagation Delay-Max@Nom-Sup (ns)
    200

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RD74HV8T07TH0
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RD74HV8T07TH0