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RD38F2010W0YBQ0

Intel Corporation

Intel Corporation RD38F2010W0YBQ0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    8 mm
  • Length
    10 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B88
  • Memory Width
    16
  • Organization
    4MX16
  • Package Code
    TFBGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    67108864 bit
  • Memory IC Type
    MEMORY CIRCUIT
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    65 ns
  • Number of Words
    4194304 words
  • Terminal Finish
    TIN LEAD
  • Mixed Memory Type
    FLASH+SRAM
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    CONTAINS 4 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH
  • Supply Current-Max
    25 mA
  • Number of Functions
    1
  • Number of Terminals
    88
  • Standby Current-Max
    6.0E-6 Amp
  • Number of Words Code
    4M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA88,8X12,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel
  • Supply Voltage-Max (Vsup)
    1.95 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V

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