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PA28F200BX-B70

Intel Corporation

Intel Corporation PA28F200BX-B70
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Sector Size
    16K,8K,96K,128K Words
  • Data Polling
    NO
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    16
  • Organization
    128KX16
  • Package Code
    SOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    2097152 bit
  • Memory IC Type
    FLASH
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    70 ns
  • Number of Words
    131072 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    70 mA
  • Number of Terminals
    44
  • Standby Current-Max
    1.2E-6 Amp
  • Number of Words Code
    128K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Command User Interface
    YES
  • Number of Sectors/Size
    1,2,1,1
  • Package Equivalence Code
    SOP44,.63
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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PA28F200BX-B70
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