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MURD4016GVHBCA00ABA0

TDK Corporation

TDK Corporation MURD4016GVHBCA00ABA0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Width
    11 mm
  • Length
    15 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-XUUC-N
  • Memory Width
    8
  • Organization
    16GX8
  • Package Code
    DIE
  • Package Shape
    RECTANGULAR
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory Density
    137438953472 bit
  • Memory IC Type
    FLASH CARD
  • Operating Mode
    ASYNCHRONOUS
  • Number of Words
    17179869184 words
  • Temperature Grade
    OTHER
  • Terminal Position
    UPPER
  • Number of Functions
    1
  • Number of Words Code
    16G
  • Package Body Material
    UNSPECIFIED
  • Package Equivalence Code
    DIE OR CHIP
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V

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MURD4016GVHBCA00ABA0