产品制造商
提交询价BOM 工具

MT57L256H18PB-7TR

Micron Technology

Micron Technology MT57L256H18PB-7TR
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    22
  • JESD-30 Code
    R-PBGA-B153
  • Memory Width
    18
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    CACHE SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Memory Organization
    256KX18
  • Number of Functions
    1
  • Number of Terminals
    153
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    256K
  • Memory Density (bits)
    4718592
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.4
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3.1
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    262144

MT57L256H18PB-7TR有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
MT57L256H18PB-7TR
提交询价
MT57L256H18PB-7TR