TEMIC SEMICONDUCTORS MMCP-67204FV-30/883 | 搜芯易Sourcengine

TEMIC SEMICONDUCTORS MMCP-67204FV-30/883

生命周期状态
Transferred
说明
FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
R-CDIP-T28
Memory Width
9
Package Code
DIP
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Cycle Time (ns)
40
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
4KX9
Number of Functions
1
Number of Terminals
28
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
30
Number of Words Code
4K
Memory Density (bits)
36864
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
4096
Standby Current-Max (A)
0.005
Supply Current-Max (mA)
110
Package Equivalence Code
DIP28,.3
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883 Class B