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MG80960MC

Intel Corporation

Intel Corporation MG80960MC
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    36.802
  • Length (mm)
    36.802
  • Speed (MHz)
    25
  • JESD-30 Code
    S-CPGA-P132
  • Package Code
    PGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Low Power Mode
    NO
  • Integrated Cache
    NO
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Number of Terminals
    132
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    4.061
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    32
  • Clock Frequency-Max (MHz)
    25
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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MG80960MC
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MG80960MC