Analog Devices, Inc. MAXQ617V-L000+T | 搜芯易Sourcengine

Analog Devices, Inc. MAXQ617V-L000+T

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Infrared Remote Control System-on-Chip
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

JESD-30 Code
S-PBGA-B16
Package Code
FBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Finish
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Number of Terminals
16
Terminal Pitch (mm)
0.4
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA16,4X4,16
Moisture Sensitivity Level
1
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
-20
Time@Peak Reflow Temperature-Max (s)
30