Maxim Integrated MAX7359EWA+ | 搜芯易Sourcengine

Maxim Integrated MAX7359EWA+

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Microprocessor Circuit, BICMOS, PBGA25
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs MICROPROCESSOR CIRCUIT

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.31.00.01
SB Code
8542.31.00.00

Technology
BICMOS
Width (mm)
2.09
Length (mm)
2.09
JESD-30 Code
S-PBGA-B25
Package Code
VFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e2
Terminal Finish
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
25
Terminal Pitch (mm)
0.4
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
0.69
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
1.62
Supply Voltage-Nom (V)
2.5
Supply Current-Max (mA)
0.06
Package Equivalence Code
BGA25,5X5,16
Moisture Sensitivity Level
1
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30