MILL-MAX Mfg. Corp M83734/10-029 | 搜芯易Sourcengine

MILL-MAX Mfg. Corp M83734/10-029

生命周期状态
EOL
说明
IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.90.40.00
SB Code
8536.90.40.00

Contact Style
RND PIN-SKT
J-STD-609 Code
e0
Mounting Style
STRAIGHT
Contact Material
NOT APPLICABLE
Housing Material
PLASTIC
Termination Type
SOLDER
Additional Feature
STANDARD: MIL-S-83734, STACKABLE
Body Length (inch)
2.05
Device Socket Type
IC SOCKET
Number of Contacts
40
Body Breadth (inch)
0.7
Device Type Used On
DIP40
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
2.54
Contact Finish - Mating
NOT APPLICABLE
Socket Body Depth (inch)
0.175
Mating Contact Pitch (inch)
0.1
Contact Finish - Termination
Tin/Lead (Sn/Pb)
PCB Contact Row Spacing (mm)
15.24