Cypress Semiconductor Corporation M1830HD-55MB | 搜芯易Sourcengine

Cypress Semiconductor Corporation M1830HD-55MB

生命周期状态
Discontinued
REACH
REACH compliant
说明
SRAM Module, 64KX32, 55ns, CMOS, CDIP60
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-XDIP-T60
Memory Width
32
Package Code
DIP
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
64KX32
Number of Terminals
60
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
55
Number of Words Code
64K
Memory Density (bits)
2097152
Package Body Material
CERAMIC
Output Characteristics
3-STATE
Supply Voltage-Nom (V)
5
Number of Words (words)
65536
Standby Current-Max (A)
0.16
Standby Voltage-Min (V)
4.5
Supply Current-Max (mA)
880
Package Equivalence Code
DIP60,.6
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883 Class B (Modified)