产品制造商
提交询价BOM 工具

LC27C203C55V05

Intel Corporation

Intel Corporation LC27C203C55V05
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T40
  • Memory Width
    16
  • Organization
    16KX16
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    262144 bit
  • Memory IC Type
    UVPROM
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    50 ns
  • Number of Words
    16384 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    100 mA
  • Number of Terminals
    40
  • Standby Current-Max
    0.1 Amp
  • Number of Words Code
    16K
  • Package Body Material
    CERAMIC
  • Output Characteristics
    REGISTERED
  • Package Equivalence Code
    DIP40,.6
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

LC27C203C55V05有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
LC27C203C55V05
提交询价
LC27C203C55V05