Integrated Device Technology, Inc. IDT72T72115L5BB | 搜芯易Sourcengine

Integrated Device Technology, Inc. IDT72T72115L5BB

生命周期状态
Transferred
说明
FIFO, 128KX72, 3.6ns, Synchronous, CMOS, PBGA324
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
19
Length (mm)
19
JESD-30 Code
S-PBGA-B324
Memory Width
72
Package Code
BGA
Output Enable
YES
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Cycle Time (ns)
5
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
ASYNCHRONOUS OPERATION ALSO POSSIBLE
Memory Organization
128KX72
Number of Functions
1
Number of Terminals
324
Terminal Pitch (mm)
1
Access Time-Max (ns)
3.6
Number of Words Code
128K
Memory Density (bits)
9437184
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.97
Supply Voltage-Max (V)
2.625
Supply Voltage-Min (V)
2.375
Supply Voltage-Nom (V)
2.5
Number of Words (words)
131072
Standby Current-Max (A)
0.05
Supply Current-Max (mA)
60
Package Equivalence Code
BGA324,18X18,40
Clock Frequency-Max (MHz)
200
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30