Integrated Device Technology, Inc. IDT72P51549L6BB | 搜芯易Sourcengine

Integrated Device Technology, Inc. IDT72P51549L6BB

生命周期状态
Discontinued
说明
FIFO, 32KX36, 3.7ns, Asynchronous, CMOS, PBGA256
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-PBGA-B256
Memory Width
36
Organization
32KX36
Package Code
BGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
1179648 bit
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Terminal Pitch
1 mm
Access Time-Max
3.7 ns
Number of Words
32768 words
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Supply Current-Max
150 mA
Number of Terminals
256
Standby Current-Max
0.1 Amp
Number of Words Code
32K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA256,16X16,40
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
1.8 V
Clock Frequency-Max (fCLK)
166 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30