IBM0418A4CXLBB-3

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBM0418A4CXLBB-3
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B153
  • Memory Width
    18
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Memory Organization
    512KX18
  • Number of Functions
    1
  • Number of Terminals
    153
  • Access Time-Max (ns)
    2
  • Number of Words Code
    512K
  • Memory Density (bits)
    9437184
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    524288

IBM0418A4CXLBB-3有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
IBM0418A4CXLBB-3
提交询价
IBM0418A4CXLBB-3