Renesas Electronics Corp. HXT45430-DNU | 搜芯易Sourcengine

Renesas Electronics Corp. HXT45430-DNU

生命周期状态
EOL
RoHS
符合RoHS标准
REACH
REACH compliant
说明
112Gb/s PAM4 Silicon Photonic Modulator Driver DIE SALE (PRICE IN GOOD DIE)-WAFFLE PACK
类别
Semiconductors Interface ICs Other Interface ICs INTERFACE CIRCUIT

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Width (mm)
2.015
Length (mm)
3.995
JESD-30 Code
R-XUCC-N
Package Code
DIE
Package Shape
RECTANGULAR
Package Style
UNCASED CHIP Meter
Surface Mount
YES
Terminal Form
NO LEAD
J-STD-609 Code
e3
Terminal Finish
Tin (Sn)
Interface IC Type
INTERFACE CIRCUIT
Terminal Position
UPPER
Number of Functions
1
Package Body Material
UNSPECIFIED
Package Equivalence Code
DIE OR CHIP
Operating Temperature-Max (Cel)
105
Operating Temperature-Min (Cel)
-5
Width
0
Length
0